LED module

Groups of semiconductor components dedicated to LED lighting, designed for various professional and domestic applications: LED Module: compact plastic casing (7 × 7 × 5 mm) incorporating an LED chip mounted in parallel with a Zener diode, to be assembled on a surface-mounted circuit board (SMC). Intended for specialized electronic lighting (flash, automotive, signaling, etc.). LED Module on a PCB with metallic core: similar LED module soldered onto a printed circuit board serving as a heat sink (21 mm diameter), with soldering pads for electrical connection, intended for integration into high-performance final lighting systems. LED Assembly: casing (6 × 5 × 1 mm) containing four separate LED chips, each associated with a Zener diode, with back contacts for surface-mounting integration, intended for lighting in entertainment, architecture, or ambiance. LED Panel: circular assembly (49 mm diameter) of 156 interconnected LED chips in series/parallel, housed in a plastic casing with heat sink and screw fixation, designed for general or professional lighting (retrofit, commercial, road lighting, etc.). These components, physically inseparable, fall under semiconductor devices with electroluminescent diodes (HS 8541), subject to CE marking (RoHS, electrical safety), REACH regulation concerning plastics, solders, and metal alloys, and labeling regarding heat dissipation and power.

Sep 25, 2014

LED module

Groups of semiconductor components dedicated to LED lighting, designed for various professional and domestic applications: LED Module: compact plastic casing (7 × 7 × 5 mm) incorporating an LED chip mounted in parallel with a Zener diode, to be assembled on a surface-mounted circuit board (SMC). Intended for specialized electronic lighting (flash, automotive, signaling, etc.). LED Module on a PCB with metallic core: similar LED module soldered onto a printed circuit board serving as a heat sink (21 mm diameter), with soldering pads for electrical connection, intended for integration into high-performance final lighting systems. LED Assembly: casing (6 × 5 × 1 mm) containing four separate LED chips, each associated with a Zener diode, with back contacts for surface-mounting integration, intended for lighting in entertainment, architecture, or ambiance. LED Panel: circular assembly (49 mm diameter) of 156 interconnected LED chips in series/parallel, housed in a plastic casing with heat sink and screw fixation, designed for general or professional lighting (retrofit, commercial, road lighting, etc.). These components, physically inseparable, fall under semiconductor devices with electroluminescent diodes (HS 8541), subject to CE marking (RoHS, electrical safety), REACH regulation concerning plastics, solders, and metal alloys, and labeling regarding heat dissipation and power.

Sep 25, 2014

LED module

Groups of semiconductor components dedicated to LED lighting, designed for various professional and domestic applications: LED Module: compact plastic casing (7 × 7 × 5 mm) incorporating an LED chip mounted in parallel with a Zener diode, to be assembled on a surface-mounted circuit board (SMC). Intended for specialized electronic lighting (flash, automotive, signaling, etc.). LED Module on a PCB with metallic core: similar LED module soldered onto a printed circuit board serving as a heat sink (21 mm diameter), with soldering pads for electrical connection, intended for integration into high-performance final lighting systems. LED Assembly: casing (6 × 5 × 1 mm) containing four separate LED chips, each associated with a Zener diode, with back contacts for surface-mounting integration, intended for lighting in entertainment, architecture, or ambiance. LED Panel: circular assembly (49 mm diameter) of 156 interconnected LED chips in series/parallel, housed in a plastic casing with heat sink and screw fixation, designed for general or professional lighting (retrofit, commercial, road lighting, etc.). These components, physically inseparable, fall under semiconductor devices with electroluminescent diodes (HS 8541), subject to CE marking (RoHS, electrical safety), REACH regulation concerning plastics, solders, and metal alloys, and labeling regarding heat dissipation and power.

Sep 25, 2014

LED module

Groups of semiconductor components dedicated to LED lighting, designed for various professional and domestic applications: LED Module: compact plastic casing (7 × 7 × 5 mm) incorporating an LED chip mounted in parallel with a Zener diode, to be assembled on a surface-mounted circuit board (SMC). Intended for specialized electronic lighting (flash, automotive, signaling, etc.). LED Module on a PCB with metallic core: similar LED module soldered onto a printed circuit board serving as a heat sink (21 mm diameter), with soldering pads for electrical connection, intended for integration into high-performance final lighting systems. LED Assembly: casing (6 × 5 × 1 mm) containing four separate LED chips, each associated with a Zener diode, with back contacts for surface-mounting integration, intended for lighting in entertainment, architecture, or ambiance. LED Panel: circular assembly (49 mm diameter) of 156 interconnected LED chips in series/parallel, housed in a plastic casing with heat sink and screw fixation, designed for general or professional lighting (retrofit, commercial, road lighting, etc.). These components, physically inseparable, fall under semiconductor devices with electroluminescent diodes (HS 8541), subject to CE marking (RoHS, electrical safety), REACH regulation concerning plastics, solders, and metal alloys, and labeling regarding heat dissipation and power.

Sep 25, 2014